THERMAL MANAGEMENT OF ELECTRONICS : BASICS TO ADVANCED LEVEL

Become Thermal Analyst/Expert

HELLO ,

What you’ll learn

  • THE REASONS BEHIND THE NEED OF THERMAL MANAGEMENT IN THE FIELD OF ELECTRONICS.
  • HOW TO CALCULATE ‘HEAT FLOW RATE’ AND ‘THERMAL RESISTANCE’ IN PARALLEL CONNECTED CONDUCTORS.
  • TECHNICAL TERMINOLOGIES (with detailed explanation) ASSOCCIATED WITH “THERMAL MANAGEMENT” ..
  • INDEPTH DETAILS OF – CURRENTLY USED THERMAL MANAGEMENT TECHNIQUES.
  • DERIVATION ON : TOTAL HEAT FLUX & TOTAL THERMAL RESISTANCE.
  • THERMAL AND ELECTRICAL EQUIVALENT RELATIONSHIPS.
  • 4 THERMAL DESIGNS RULES.
  • WHAT ADVANCED THERMAL MANAGEMENT TECHNIQUES HAS BEEN RECENTLY DEVELOPED.

Course Content

  • Introduction –> 5 lectures • 13min.
  • FUNDAMENTAL CONCEPT OF HEAT TRANSFER & TERMINOLOGIES –> 8 lectures • 26min.
  • ANALOGUE BETWEEN THERMAL & ELECTRICAL CONDUCTIVITY –> 2 lectures • 5min.
  • THERMAL MANAGEMENT SOLUTIONS –> 4 lectures • 10min.
  • THERMAL DESIGN RULES –> 1 lecture • 5min.
  • ADVANCED THERMAL CONDUCTIVE MATERIALS –> 1 lecture • 5min.
  • CONCLUSION & THANKS GIVING –> 1 lecture • 2min.

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Requirements

HELLO ,

MY NAME IS  Riya B .S. Pal   .

THIS COURSE HAS BEEN DESIGNED LOOKING AT THE REQUIREMENT BY THE STUDENTS . THROUGH THIS COURSE  , STUDENTS WILL COME TO KNOW THE EXISTING SCENARIO OF THE ELECTRONICS WORLD  .  THIS COURSE WILL PROVIDE YOU IN-DEPTH KNOWLEDGE ON THE BELOW TOPICS :

COURSE INTRODUCTION   /   WHY THERMAL MANAGEMENT IS IMPORTANT  /   THERMAL MANAGEMENT CHALLENGES AT LEVEL 1 (CHIP LEVEL)  /  THERMAL MANAGEMENT CHALLENGES AT LEVEL 2 (PCB/BOARD LEVEL)  /  THERMAL MANAGEMENT CHALLENGES AT LEVEL 3 (ENVELOPE / PACKAGING LEVEL)  /  SKIN TEMPERATUR  /  CONDUCTION , CONVECTION & RADIATION  /  HEAT FLUX & HEAT FLOW RATE  / CALCULATION : HEAT TRANSFER RATE (CONDUCTION METHOD)  /  THERMAL RESISTANCE (CONDUCTION MODE OF HEAT TRANSFER) & HEAT TRANSFER COEFFICIENT  /  THERMAL CONDUCTIVITY  /  NEWTON’S LAW OF COOLING  /  TO CALCULATE TOTAL (Q) & THERMAL RESISTANCE (Rth) FOR A PARALLEL CONNECTED CONDUCTORS  /  REASON BEHIND ELECTRICAL-THERMAL EQUIVALENT RELATIONSHIP  /  EQUIVALENT CIRCUIT REPRESENTATION  /  WHICH ALUMINUM & COPPER ALLOY TO BE USED FOR HEAT SINK  /  ALL ABOUT TIM’S (THERMAL INTERFACE MATERIALS)  /   TIM (THERMAL PASTE) V/s TIM (THERMAL PADS) V/s (THERMAL GEL) V/s (THERMAL LIQUID GAP FILLERS)  /  TIM (PCM : PHASE CHANGE MATERIALS)   /   DESIGN RULES NUMBER 1 : CONTROLLING THE WORKING TEMPERATURE OF THE COMPONENTS  /  DESIGN RULES NUMBER 2 : USING MULTI-LAYERED  /  SINGLE LAYERD PCB METAL CORE BOARD  /  DESIGN RULES NUMBER 3 : PLACEMENT OF THE HEAT SOURCE   /    DESIGN RULES NUMBER 4 : COMPONENTS ASSEMBLY  /  ADVANCED THERMAL MATERIALS ( Al-DIAMOND   /   Al-SiC  /   Al-Si   /  Cu- MATRIX ).